SWISSto12 and Mitsubishi Electric sign MoU, with 3D printing at the core of next-gen payloads

SWISSto12 and Mitsubishi Electric Corporation (MELCO) have signed a Memorandum of Understanding to pursue joint opportunities on advanced payloads, radio frequency (RF) products, and market development in Japan and the APAC region. Additive manufacturing sits at the center of the agreement: the partnership will combine MELCO's satellite system expertise and integration capabilities with SWISSto12's proprietary 3D-printing designs and processes.

A partnership built on printed hardware

This is not a speculative tie-up. SWISSto12's 3D printing technology forms the foundation of its next-generation payloads, and the company already has more than 2,000 products in orbit. Market adoption of its HummingLink product is growing, giving the partnership an installed base to build from rather than a blank sheet.

The collaboration is aimed squarely at rising regional demand. Both companies point to growing appetite in APAC for advanced payloads and RF products across sovereign applications, with Japan as the initial focal point.

Emile de Rijk, Chief Executive Officer of SWISSto12, framed the deal around sovereign capability:

"We are proud to partner strategically with MELCO and support the next-generation sovereign communications system of Japan. Demand in APAC is growing for innovative, advanced payloads and RF products across sovereign land, sea, air, and space applications and we are confident that together, we can scale our ability to meet it."

Contract already in hand

Alongside the MoU, MELCO has awarded SWISSto12 a contract to provide advanced phased array antenna products for the GEO secure communications program of the Japanese Government. That gives the partnership immediate, concrete work — not just a framework for future discussions.

Masahiko Arai, Executive Officer and Group President, Defense & Space Systems at Mitsubishi Electric Corporation, emphasized the complementarity of the two organizations:

"SWISSto12's innovative technologies, including its 3D-printing-based component manufacturing technology and small geostationary satellite platform, hold tremendous potential. By combining these technologies with our expertise in the development and manufacturing of defense- and space-related systems, which we have cultivated over the years, we are confident that we can deliver unprecedented value to our customers. Through this collaboration, we will leverage the respective strengths of both companies to pursue new business opportunities in Japan and international markets, while working to deliver advanced and highly competitive defence and space solutions."

Capacity to scale

The timing is notable. Earlier this year, SWISSto12 raised $70m to scale its manufacturing and integration capacity — capital that now has a clear outlet through a partner with deep integration experience in defense and space systems. Whether the pairing can convert a memorandum into sustained production volume remains the open question, but with a phased array antenna contract already signed and thousands of printed products flying, the starting position is stronger than most MoUs manage.